Chip Design Academy
Module 09
Physical Design
Intermediate
65 minutes

Floorplanning, IO and Power Intent

Turn the logical hierarchy into die/core geometry, macro placement, IO organization, voltage areas and a feasible power-delivery plan.

WHY IT MATTERS

Overview

Floorplanning determines die and core dimensions, utilization, aspect ratio, macro locations, placement blockages, routing channels and IO topology. These choices shape congestion, timing, power and routability.

Power intent defines voltage domains, isolation, retention, level shifting, power switches and legal power states. The physical power network must deliver current with acceptable voltage drop and electromigration margin.

Learning objectives

Estimate die/core area and utilization

Place macros using connectivity and channels

Plan IO, bumps and voltage domains

Create a PDN and early feasibility checks

TECHNICAL FOUNDATION

Core concepts

Utilization

Placed standard-cell area divided by available placement area.

Aspect ratio

Core height-to-width relationship, affecting wirelength and routing distribution.

Halo/channel

Reserved space around or between macros for pins, buffers and routing.

Voltage area

Physical region implementing logic at a specific supply domain.

Power grid

Hierarchical rings, straps, rails and vias distributing supply and return current.

UPF

Power-intent description of domains, states, isolation, retention and supply relationships.

INPUTS → DECISIONS → EVIDENCE

Engineering workflow

1
Estimate geometry

Reconcile cell, macro, IO, analog and margin area.

INPUTS

Netlist

Macros

Package

OUTPUTS

Die/core dimensions

2
Place macros and IO

Use connectivity, pin access, hierarchy and routing channels.

INPUTS

Connectivity

IO plan

OUTPUTS

Macro floorplan

Pin plan

3
Define power intent

Map power states and special cells to physical domains.

INPUTS

Power architecture

OUTPUTS

UPF

Voltage areas

4
Build and analyze PDN

Size straps and vias using current estimates and early IR analysis.

INPUTS

Activity

Metal rules

OUTPUTS

PDN

IR/EM feasibility

MEASURE WHAT MATTERS

Metrics and interpretation

Core utilization

Density target before detailed placement and routing effects.

Macro channel capacity

Available routing tracks relative to estimated demand.

Early IR drop

Estimated supply loss under representative current loading.

Pin accessibility

Ability of routing resources to reach macro and block terminals.

REVIEW READINESS

Signoff checklist and pitfalls

Evidence checklist
  • Area reconciliation includes physical-only cells
  • Macros have legal orientation, halos and channel capacity
  • IO/package assignment is consistent
  • Voltage areas and special cells match power intent
  • PDN passes early IR/EM feasibility
Common pitfalls
  • Overaggressive utilization
  • Macros placed by visual symmetry instead of connectivity
  • Ignoring macro pin access
  • Designing the package after die IO is frozen
LEARN BY DOING

Practice and platform tools

PRACTICAL EXERCISE
Floorplan a small SoC with CPU, SRAMs and an accelerator; justify die size, macro channels, IO sides, voltage domains and PDN topology.
Floorplan

Explore die/core and macro placement.

Open tool
PDN Generator

Plan power straps and rails.

Open tool
Pin Assignment

Organize block and IO pins.

Open tool
Bump/RDL

Coordinate die and package connectivity.

Open tool
AUTHORITATIVE FOLLOW-UP

References


Continue learning
Physical Design

Placement, Clock-Tree Synthesis and Routing

Open module
Signoff

Power, IR Drop, EM, Thermal and Reliability

Open module
System Integration

Packaging, Chiplets, SI/PI and Board Integration

Open module